Record link: 
http://hdl.handle.net/20.500.12708/191276
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Title: 
In-situ Delaminationsmessung in Mehrlagenstrukturen der Elektronik
de
Citation: 
Walter, T., & Khatibi Damavandi, G. (2023). In-situ Delaminationsmessung in Mehrlagenstrukturen der Elektronik. In H. Gremmel-Simon (Ed.), Energie und Klimawandel : Energie - Gebäude - Umwelt : e-nova, international conference, 14. und 15. Juni 2023, Band 26 (pp. 207–214). Holzhausen.
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Publication Type: 
Inproceedings - Full-Paper Contribution
en
Language: 
German
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Authors: 
Walter, Thomas 
Khatibi Damavandi, Golta 
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Organisational Unit: 
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit 
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Published in: 
Energie und Klimawandel : Energie - Gebäude - Umwelt : e-nova, international conference, 14. und 15. Juni 2023, Band 26 
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ISBN: 
978-3-903207-79-0
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Volume: 
29
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DOI of the book: 
10.57739/978-3-903207-79-0
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Date (published): 
Jun-2023
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Event name: 
e-nova International Conference 2023 
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Event date: 
14-Jun-2023 - 15-Jun-2023
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Event place: 
Pinkafeld, Austria
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Number of Pages: 
8
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Publisher: 
Holzhausen, Wien
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Keywords: 
semiconductors; solder joints; reliability; lifetime; multilayers
en
Research Areas: 
Materials Characterization: 40%
Surfaces and Interfaces: 40%
Modeling and Simulation: 20%
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Science Branch: 
1040 - Chemie: 50%
1030 - Physik, Astronomie: 50%
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Appears in Collections:
Conference Paper

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