Kretschmer, A., Bohrn, F., Hutter, H., Pitthan, E., Tran, T. T., Primetzhofer, D., & Mayrhofer, P. H. (2023). Analysis of (Al,Cr,Nb,Ta,Ti)-nitride and -oxynitride diffusion barriers in Cu-Si interconnects by 3D-Secondary Ion Mass Spectrometry. Materials Characterization, 197, Article 112676. https://doi.org/10.1016/j.matchar.2023.112676