Yakymovych, A., Wodak, I., Moser, N., & Khatibi, G. (2025). Hybrid solder joints: DTA measurements of the Sn-based Fe–Sn/(Sn–Ag–Cu) alloys in bulk and nanocomposite form. Journal of Physical Studies, 29(4), Article 4606. https://doi.org/10.30970/jps.29.4606
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit
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Journal:
Journal of Physical Studies
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ISSN:
1027-4642
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Date (published):
2025
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Number of Pages:
6
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Publisher:
Vydavnychyi Tsentr L'vivs'koho Natsional'noho Universytetu imeni Ivana Franka
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Peer reviewed:
Yes
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Keywords:
SAC305 lead-free solder; DTA measurements; Fe nanoparticles; phase transitions
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Abstract:
Differential Thermal Analysis (DTA) of liquid binary Fe-Sn and quaternary Fe-(Sn-Ag3.0-Cu0.5) alloys was used to determine the characteristic temperatures in the range between room temperature and 1200°C. The nanocomposite alloys were produced by cold pressing of nanosized Fe powder with Sn or Sn-Ag3.0-Cu0.5 powder. The concentration of Fe did not exceed 4.0 wt.%. The cooling-heating curve thermal analysis was performed to study the melting and solidification behavior of the investigated binary and quaternary alloys. Additionally, the microstructural analysis of the investigated samples showed the formation of FeSn$_2$ intermetallic compounds in the Sn-matrix.
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Project title:
Hybrid-Lötstellen - neue vielversprechende Lötstrategie: P 34894-N (FWF - Österr. Wissenschaftsfonds)
CC BY 4.0
