Aspalter, A., Cerny, A., Goeschl, M., Podsednik, M., Khatibi, G., Yakymovych, A., & Plevachuk, Y. (2020). Hybrid solder joints: morphology and shear strength of Sn–3.0Ag–0.5Cu solder joints by adding ceramic nanoparticles through flux doping. Applied Nanoscience, 10, 4943–4949. https://doi.org/10.1007/s13204-020-01398-8
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit E164 - Institut für Chemische Technologien und Analytik
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Journal:
Applied Nanoscience
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ISSN:
2190-5509
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Date (published):
23-Apr-2020
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Number of Pages:
7
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Publisher:
SPRINGER HEIDELBERG
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Peer reviewed:
Yes
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Keywords:
Electrical and Electronic Engineering; Atomic and Molecular Physics, and Optics; Biotechnology; Cell Biology; Physical and Theoretical Chemistry; Materials Science (miscellaneous)
