Record link: 
http://hdl.handle.net/20.500.12708/78630
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Title: 
Process development of thermal sintering processes for printable Cu pastes on semiconductor wafers
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Citation: 
Dillinger, F. (2020). Process development of thermal sintering processes for printable Cu pastes on semiconductor wafers [Diploma Thesis, Technische Universität Wien]. reposiTUm. http://hdl.handle.net/20.500.12708/78630
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CatalogPlus: 
AC15719263
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Publication Type: 
Thesis - Diplomarbeit
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Language: 
English
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Authors: 
Dillinger, Felix 
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Advisor: 
Gierl-Mayer, Christian 
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Organisational Unit: 
E164 - Institut für Chemische Technologien und Analytik 
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Date (published): 
2020
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Number of Pages: 
77
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Keywords: 
Sintern; Cu-Pasten; Si-Wafer
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sinering; copper pastes; Si-wafers
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Additional information: 
Abweichender Titel nach Übersetzung der Verfasserin/des Verfassers
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Appears in Collections:
Thesis

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