Record link: 
http://hdl.handle.net/20.500.12708/80013
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Title: 
Assessment of the environmental performance of standard printed circuit board production and embedded component packaging at AT&S, Leoben
en
Citation: 
Kupka, T. (2018). Assessment of the environmental performance of standard printed circuit board production and embedded component packaging at AT&S, Leoben [Diploma Thesis, Technische Universität Wien]. reposiTUm. http://hdl.handle.net/20.500.12708/80013
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CatalogPlus: 
AC15073728
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Publication Type: 
Thesis - Diplomarbeit
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Language: 
English
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Authors: 
Kupka, Tobias 
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Advisor: 
Wimmer, Wolfgang 
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Organisational Unit: 
E307 - Institut für Konstruktionswissenschaften und Technische Logistik 
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Date (published): 
2018
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Number of Pages: 
204
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Keywords: 
Product Carbon Footprint; Printed Circuit Boards; Embedded Corponent Packaging
de
 
Product Carbon Footprint; Leiterplatten; Embedded Corponent Packaging
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Abstract: 
null
de
Appears in Collections:
Thesis

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