2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

Book title Buchtitel
2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
 
ISBN
979-8-3315-1635-2
 
DOI
10.1109/SISPAD62626.2024
 

Publications Publikationen

Results 1-5 of 5 (Search time: 0.002 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Bamer, Balazs ; Leroch, Sabine ; Hossinger, Andreas ; Filipovic, Lado Cluster-Based Semi-Empirical Model for Dopant Activation in Silicon CarbideInproceedings Konferenzbeitrag 2024
2Gull, Josef ; Filipovic, Lado ; Kosina, Hans Electron-Electron Scattering in Non-Parabolic Transport ModelsInproceedings Konferenzbeitrag 2024
3Filipovic, Lado ; Reiter, Tobias ; Piso, Julius ; Kostal, Roman Equipment-Informed Machine Learning-Assisted Feature-Scale Plasma Etching ModelInproceedings Konferenzbeitrag 2024
4Gentles, Angus ; Dehghani, Mohammad ; Minixhofer, Rainer ; Khakbaz, Pedram ; Waldhor, Dominic ; Waltl, Michael Modeling Next Generation Sensor Chips: Towards Predictive Band Structure Models for Quarternary III-V Semiconductor AlloysInproceedings Konferenzbeitrag 31-Oct-2024
5Hu, Ziyi ; Filipovic, Lado ; Li, Junjie ; Wang, Lingfei ; Wu, Zhicheng ; Chen, Rui ; Wei, Yayi ; Li, Ling Modeling Non-Uniformity During Two-Step Dry Etching of Si/SiGe Stacks for Gate-All-Around FETsInproceedings Konferenzbeitrag 2024