Gentles, A., Dehghani, M., Minixhofer, R., Khakbaz, P., Waldhor, D., & Waltl, M. (2024). Modeling Next Generation Sensor Chips: Towards Predictive Band Structure Models for Quarternary III-V Semiconductor Alloys. In 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), United States of America (the). https://doi.org/10.1109/SISPAD62626.2024.10732909