2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

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Description

Event name
2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
 
Event type
Event for scientific audience
 
Start date
24-09-2024
End date
27-09-2024
 
Location
San Jose, CA
Country
United States
 
Event format Veranstaltungsformat
On Site

Publications Publikationen

Results 1-4 of 4 (Search time: 0.001 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Gull, Josef ; Filipovic, Lado ; Kosina, Hans Electron-Electron Scattering in Non-Parabolic Transport ModelsInproceedings Konferenzbeitrag 2024
2Filipovic, Lado ; Reiter, Tobias ; Piso, Julius ; Kostal, Roman Equipment-Informed Machine Learning-Assisted Feature-Scale Plasma Etching ModelInproceedings Konferenzbeitrag 2024
3Gentles, Angus ; Dehghani, Mohammad ; Minixhofer, Rainer ; Khakbaz, Pedram ; Waldhor, Dominic ; Waltl, Michael Modeling Next Generation Sensor Chips: Towards Predictive Band Structure Models for Quarternary III-V Semiconductor AlloysInproceedings Konferenzbeitrag 31-Oct-2024
4Hu, Ziyi ; Filipovic, Lado ; Li, Junjie ; Wang, Lingfei ; Wu, Zhicheng ; Chen, Rui ; Wei, Yayi ; Li, Ling Modeling Non-Uniformity During Two-Step Dry Etching of Si/SiGe Stacks for Gate-All-Around FETsInproceedings Konferenzbeitrag 2024