Name Card

Full name Familienname, Vorname
Lederer, Martin
 
Main Affiliation Organisations­zuordnung
 

Own Publications Eigene Publikationen

Results 1-20 of 47 (Search time: 0.001 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Delshadmanesh, Mitra ; Lederer, Martin ; Frank, Johannes ; Khatibi Damavandi, Golta Study of fatigue life and fatigue notch sensitivity of biocompatible Co-Cr alloy L605Inproceedings KonferenzbeitragSep-2023
2Lederer-2023-Power Electronic Devices and Components-vor.pdf.jpgLederer, Martin ; Betzwar Kotas, Agnieszka Monika ; Khatibi, G. Lifetime modeling of solder joints based on accelerated mechanical testing and Finite Element AnalysisArticle Artikel Mar-2023
3Khatibi Damavandi, Golta ; Czerny, Bernhard ; Walter, Thomas ; Lederer, Martin ; Betzwar Kotas, Agnieszka Monika ; Zareghomsheh, Mohammad PoF Based Accelerated TestingPresentation VortragJun-2022
4Lederer, Martin ; Gökdeniz, Zeynep Gökce ; Khatibi Damavandi, Golta ; Nicolics, Johann Temperaturabhängigkeit mechanischer Eigenschaften von Niedertemperatur-Silber-Sinterschichten und deren Modellierung für die Nutzung in FiniteElemente-SimulationenInproceedings KonferenzbeitragJun-2022
5Lederer, Martin ; Betzwar Kotas, Agnieszka Monika ; Khatibi Damavandi, Golta Accelerated Fatigue Testing and Lifetime Modelling of Solder Interconnects in Power ElectronicsPresentation Vortrag2022
6Betzwar Kotas, Agnieszka Monika ; Lederer, Martin ; Khatibi Damavandi, Golta ; Boczkal, Grzegorz ; Perek-Nowak M. Mechanical Reliability of Lead-Free Solder Joints: Comparative Study of Sn3.5Ag versus SnSbAg Solder AlloyPresentation Vortrag2022
7Lederer-2021-Microelectronics Reliability-vor.pdf.jpgLederer, Martin ; Gökdeniz, Zeynep Gökce ; Khatibi Damavandi, Golta ; Nicolics, Johann Constitutive equations for strain rate and temperature dependent mechanical behaviour of porous Ag-sintered joints in electronic packagesArticle Artikel Nov-2021
8Lederer, Martin ; Walter, Thomas ; Khatibi, Golta Modelling of Cyclic Delamination Behavior of Thin Multilayered Structures Using Gradient Elasticity and Damage AccumulationArtikel Article Jan-2021
9Goekdeniz, Zeynep ; Lederer, Martin ; Khatibi, Golta ; Nicolics, Johann Temperature Dependent Relaxation Behavior of Pressureless and Pressure Assisted Sintered SilverKonferenzbeitrag Inproceedings2021
10Goekdeniz, Zeynep ; Lederer, Martin ; Khatibi, Golta ; Nicolics, Johann Temperature Dependent Relaxation Behavior of Ag-Sintered Copper JointsKonferenzbeitrag Inproceedings2021
11Lederer, M. ; Gökdeniz, Z. ; Khatibi, G. ; Nicolics, J. Constitutive equations for strain rate and temperature dependent mechanical behaviour of porous Ag-sintered joints in electronic packagesArtikel Article 2021
12Lederer, M ; Walter, T ; Zareghomsheh, M ; Khatibi, G Delamination Criteria for SiN/TiW Interfaces Tested by Cross-Sectional Nanoidentation and by Four Point BendingKonferenzbeitrag Inproceedings2021
13Lederer-2020-Microelectronics Reliability-vor.pdf.jpgLederer, Martin ; Betzwar Kotas, Agnieszka Monika ; Khatibi Damavandi, Golta A lifetime assessment and prediction method for large area solder jointsArticle Artikel Nov-2020
14Lederer, Martin ; Kotas, Agnieszka Betwar ; Khatibi, Golta ; Danninger, Herbert On crack propagation in homogeneous and composite materials under mixed mode loading conditionsKonferenzbeitrag Inproceedings2020
15Zareghomsheh, Mohammad ; Khatibi, Golta ; Weiss, Brigitte ; Lederer, Martin ; Schwarz, Sabine ; Steiger-Thirsfeld, Andreas ; Tikhonovsky, M. ; Tabachnikova, E.D. ; Schafler, Erhard High cycle fatigue deformation mechanisms of a single phase CrMnFeCoNi high entropy alloyArtikel Article 2020
16Lederer, M. ; Kotas, A. Betzwar ; Khatibi, G. A lifetime assessment and prediction method for large area solder jointsArtikel Article 2020
17Lederer, Martin Material Frame Indifferent Strain Gradient Elasticity: Theoretical formulation and mixed type Finite Element implementationKonferenzbeitrag Inproceedings2020
18Saghaeian, F. ; Lederer, M. ; Hofer, A. ; Todt, J. ; Keckes, J. ; Khatibi, G. Investigation of high cyclic fatigue behaviour of thin copper films using MEMS structureArtikel Article 2019
19Mazloum-Nejadari, A. ; Lederer, Martin ; Khatibi, Golta ; Czerny, Bernhard ; Weiss, L. ; Nicolics, Johann Investigation on the Lifetime of Copper Wire Bonds in Electronic Packages under Thermal and Mechanical Cyclic LoadingKonferenzbeitrag Inproceedings2018
20Lederer, Martin ; Khatibi, Golta Balance of angular moments in structural mechanics of finite strains: A condition for second spatial derivatives of stressKonferenzbeitrag Inproceedings2018

Contributing Publications Mitbeteiligte Publikationen

Results 1-1 of 1 (Search time: 0.001 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Goekdeniz Zeynep Goekce - 2023 - Reliability of silver sintered large are joints...pdf.jpgGökdeniz, Zeynep Gökce Reliability of silver sintered large are joints: Temperature dependent mechanical properties under static and cyclic loadingThesis Hochschulschrift 2023