Full name Familienname, Vorname
Hössinger, Andreas
 
Main Affiliation Organisations­zuordnung
 


Results 1-20 of 81 (Search time: 0.002 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Reiter, Tobias ; Toifl, Alexander ; Hössinger, Andreas ; Filipovic, Lado Modeling Oxide Regrowth During Selective Etching in Vertical 3D NAND StructuresInproceedings Konferenzbeitrag20-Nov-2023
2Filipovic, Lado ; Reiter, Tobias ; Klemenschits, Xaver ; Leroch, Sabine ; Stella, Robert ; Baumgartner, Oskar ; Hössinger, Andreas Process Simulation in Micro- and Nano-ElectronicsInproceedings Konferenzbeitrag 12-Jun-2023
3Lenz-2023-Journal of Scientific Computing-vor.pdf.jpgLenz, Christoph ; Aguinsky, Luiz Felipe ; Hössinger, Andreas ; Weinbub, Josef A Complementary Topographic Feature Detection Algorithm Based on Surface Curvature for Three-Dimensional Level-Set FunctionsArticle Artikel Mar-2023
4Aguinsky-2023-Solid-State Electronics-vor.pdf.jpgAguinsky, Luiz Felipe ; Souza Berti Rodrigues, Francio ; Reiter, Tobias ; Klemenschits, Xaver ; Filipovic, Lado ; Hössinger, Andreas ; Weinbub, Josef Modeling Incomplete Conformality During Atomic Layer Deposition in High Aspect Ratio StructuresArticle Artikel Mar-2023
5Lenz, Christoph ; Aguinsky, Luiz Felipe ; Hössinger, Andreas ; Weinbub, Josef A Complementary Topographic Feature Detection Algorithm Based on Surface Curvature for Three-Dimensional Level-Set FunctionsArticle Artikel 8-Feb-2023
6Lenz-2023-Solid-State Electronics-vor.pdf.jpgLenz, Christoph ; Manstetten, Paul ; Aguinsky, Luiz Felipe ; Rodrigues, Francio ; Hössinger, Andreas ; Weinbub, Josef Automatic Grid Refinement for Thin Material Layer Etching in Process TCAD SimulationsArtikel Article Feb-2023
7Aguinsky, Luiz Felipe ; Rodrigues, Frâncio ; Wachter, Georg ; Trupke, Michael ; Schmid, Ulrich ; Hössinger, Andreas ; Weinbub, Josef Phenomenological Modeling of Low-Bias Sulfur Hexafluoride Plasma Etching of SiliconArtikel Article 2022
8Quell, Michael ; Hössinger, Andreas ; Weinbub, Josef Shared-Memory Fast Marching Method for Re-Distancing on Hierarchical MeshesKonferenzbeitrag Inproceedings 2022
9Lenz, Christoph ; Manstetten, Paul ; Hössinger, Andreas ; Weinbub, Josef Automatic Grid Refinement for Thin Material Layer Etching in Process TCAD SimulationsKonferenzbeitrag Inproceedings 2022
10Rodrigues, Francio ; Aguinsky, Luiz Felipe ; Hössinger, Andreas ; Weinbub, Josef 3D Feature-Scale Modeling of Highly Selective Fluorocarbon Plasma EtchingKonferenzbeitrag Inproceedings 2022
11Lenz, Christoph ; Toifl, Alexander ; Quell, Michael ; Rodrigues, Francio ; Hössinger, Andreas ; Weinbub, Josef Curvature Based Feature Detection for Hierarchical Grid Refinement in TCAD Topography SimulationsArtikel Article 2022
12Aguinsky, Luiz Felipe ; Rodrigues, Francio ; Klemenschits, Xaver ; Filipovic, Lado ; Hössinger, Andreas ; Weinbub, Josef Modeling Non-Ideal Conformality during Atomic Layer Deposition in High Aspect Ratio StructuresKonferenzbeitrag Inproceedings 2022
13Lenz, Christoph ; Scharinger, Alexander ; Quell, Michael ; Manstetten, Paul ; Hössinger, Andreas ; Weinbub, Josef Evaluating Parallel Feature Detection Methods for Implicit SurfacesKonferenzbeitrag Inproceedings 2021
14Quell, Michael ; Diamantopoulos, Georgios ; Hössinger, Andreas ; Weinbub, Josef Shared-Memory Block-Based Fast Marching Method for Hierarchical MeshesArtikel Article 2021
15Aguinsky, Luiz Felipe ; Wachter, Georg ; Manstetten, Paul ; Rodrigues, Frâncio ; Trupke, Michael ; Schmid, Ulrich ; Hössinger, Andreas ; Weinbub, Josef Modeling and Analysis of Sulfur Hexafluoride Plasma Etching for Silicon Microcavity ResonatorsArtikel Article 2021
16Quell, Michael ; Suvorov, V ; Hössinger, Andreas ; Weinbub, Josef Parallel Velocity Extension for Level-Set-Based Material Flow on Hierarchical Meshes in Process TCADArtikel Article 2021
17Toifl, A ; Rodrigues, F ; Aguinsky, L F ; Hössinger, A ; Weinbub, J Continuum Level-Set Model for Anisotropic Wet Etching of Patterned Sapphire SubstratesArtikel Article 2021
18Rodrigues, Francio ; Aguinsky, Luiz Felipe ; Toifl, Alexander ; Hössinger, Andreas ; Weinbub, Josef Feature Scale Modeling of Fluorocarbon Plasma Etching for Via Structures including Faceting PhenomenaKonferenzbeitrag Inproceedings 2021
19Lenz, Christoph ; Toifl, Alexander ; Hössinger, Andreas ; Weinbub, Josef Curvature Based Feature Detection for Hierarchical Grid Refinement in TCAD Topography SimulationsKonferenzbeitrag Inproceedings 2021
20Rodrigues, Francio ; Aguinsky, Luiz Felipe ; Toifl, Alexander ; Scharinger, Alexander ; Hössinger, Andreas ; Weinbub, Josef Surface Reaction and Topography Modeling of Fluorocarbon Plasma EtchingKonferenzbeitrag Inproceedings2021



Results 1-2 of 2 (Search time: 0.002 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Heinzl, René A three dimensional analytical ion implantation tool using the wafer-state-serverThesis Hochschulschrift2003
2Silnusek, Florian Molecular dynamic simulation of self-annealing effects during ion implantationThesis Hochschulschrift2002