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Full name Familienname, Vorname
Detzel, T.
 

Own Publications Eigene Publikationen

Results 1-6 of 6 (Search time: 0.001 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Ostermaier, C ; Lagger, Peter Willibald ; Reiner, Maria ; Pobegen, G. ; Pogany, Dionyz ; Prechtl, G. ; Detzel, T. ; Häberlen, O. The role of defects on reliability aspects in GaN power devicesPräsentation Presentation2019
2Wimmer, A. ; Smolka, Martin ; Heinz, W. ; Detzel, T. ; Robl, W. ; Motz, C. ; Eyert, V. ; Wimmer, E. ; Jahnel, F. ; Treichler, R. ; Dehm, G. Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samplesArtikel Article2014
3Huang, R ; Robl, W. ; Dehm, G. ; Ceric, Hajdin ; Detzel, T. Disparate Tendency of Stress Evolution of Thin and Thick Electroplated Cu Films at Room TemperatureKonferenzbeitrag Inproceedings2010
4Huang, R ; Robl, W. ; Detzel, T. ; Ceric, Hajdin Modeling of Stress Evolution of Electroplated Cu Films during Self-annealingKonferenzbeitrag Inproceedings2010
5Huang, R ; Taylor, A. ; Himmelsbach, S. ; Ceric, Hajdin ; Detzel, T. Apparatus for Measuring Local Stress of Metallic Films, Using an Array of Parallel Laser Beams during Rapid Thermal ProcessingArtikel Article2010
6Huang, R ; Robl, W. ; Ceric, Hajdin ; Detzel, T. ; Dehm, G. Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-AnnealingArtikel Article 2010