Interface characterization of Cu-Cu ball bonds by a fast shear fatigue method

Czerny, B.; Khatibi, G.

doi:10.1016/j.microrel.2020.113831

Record link:

http://hdl.handle.net/20.500.12708/141515

Title:

Interface characterization of Cu-Cu ball bonds by a fast shear fatigue method

Citation:

Czerny, B., & Khatibi, G. (2020). Interface characterization of Cu-Cu ball bonds by a fast shear fatigue method. Microelectronics Reliability, 114(113831), 113831. https://doi.org/10.1016/j.microrel.2020.113831

Publisher DOI:

10.1016/j.microrel.2020.113831

Publication Type:

Article - Original Research Article

Language:

English

Authors:

Czerny, B.
Khatibi, G.

Organisational Unit:

E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit

Journal:

Microelectronics Reliability

ISSN:

0026-2714

Date (published):

2020

Number of Pages:

Publisher:

PERGAMON-ELSEVIER SCIENCE LTD

Peer reviewed:

Yes

Keywords:

Electrical and Electronic Engineering; Condensed Matter Physics; Electronic, Optical and Magnetic Materials; Atomic and Molecular Physics, and Optics; Safety, Risk, Reliability and Quality; Surfaces, Coatings and Films

Research Areas:

Structure-Property Relationship: 35%
Surfaces and Interfaces: 35%
Modelling and Simulation: 30%

Science Branch:

Chemie
Elektrotechnik, Elektronik, Informationstechnik

Appears in Collections:

Article

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