Record link: 
http://hdl.handle.net/20.500.12708/144501
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Title: 
Characterization of cyclic delamination behavior of thin film multilayers
en
Citation: 
Walter, T., Khatibi, G., Nelhiebel, M., & Steffeneli, M. (2018). Characterization of cyclic delamination behavior of thin film multilayers. Microelectronics Reliability, 88–90, 721–725. https://doi.org/10.1016/j.microrel.2018.06.062
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Publisher DOI: 
10.1016/j.microrel.2018.06.062
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Publication Type: 
Article - Original Research Article
en
Language: 
English
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Authors: 
Walter, Thomas 
Khatibi, Golta 
Nelhiebel, Michael 
Steffeneli, Mario 
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Organisational Unit: 
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit 
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Journal: 
Microelectronics Reliability 
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ISSN: 
0026-2714
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Date (published): 
1-Oct-2018
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Number of Pages: 
5
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Publisher: 
PERGAMON-ELSEVIER SCIENCE LTD
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Peer reviewed: 
Yes
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Keywords: 
Electrical and Electronic Engineering; Condensed Matter Physics; Electronic, Optical and Magnetic Materials; Atomic and Molecular Physics, and Optics; Safety, Risk, Reliability and Quality; Surfaces, Coatings and Films
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Research Areas: 
Structure-Property Relationship: 30%
Materials Characterization: 20%
Surfaces and Interfaces: 50%
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Science Branch: 
Chemie
Elektrotechnik, Elektronik, Informationstechnik
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