Record link: 
http://hdl.handle.net/20.500.12708/152893
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Title: 
Mechanical lifetime testing of wire bonds vs power cycling
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Citation: 
Khatibi Damavandi, G., & Czerny, B. (2022). Mechanical lifetime testing of wire bonds vs power cycling [Conference Presentation]. International Workshop on integrated power packaging 2022, France.
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Publication Type: 
Presentation - Conference Presentation
en
 
Vortrag - Conference Presentation
de
Language: 
English
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Authors: 
Khatibi Damavandi, Golta 
Czerny, Bernhard 
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Organisational Unit: 
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit 
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Date (published): 
2022
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Event name: 
International Workshop on integrated power packaging 2022 
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Event date: 
24-Aug-2022 - 26-Aug-2022
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Event place: 
France
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Keywords: 
IGBT power module reliability; power cycling; thermo-mechanical fatigue; wire bond interconnects
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Research Areas: 
Surfaces and Interfaces: 50%
Modeling and Simulation: 20%
Structure-Property Relationsship: 30%
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Science Branch: 
1040 - Chemie: 50%
1030 - Physik, Astronomie: 20%
2020 - Elektrotechnik, Elektronik, Informationstechnik: 30%
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