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Walter, T., Khatibi, G., Nelhiebel, M., Heinz, W., & Robl, W. (2014). High cycle fatigue properties of Cu films. Microelectronics Reliability, 137, 64–69. https://doi.org/10.1016/j.mee.2014.12.003
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit E164 - Institut für Chemische Technologien und Analytik
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Journal:
Microelectronics Reliability
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ISSN:
0026-2714
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Date (published):
2014
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Number of Pages:
6
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Publisher:
PERGAMON-ELSEVIER SCIENCE LTD
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Peer reviewed:
Yes
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Keywords:
Electrical and Electronic Engineering; Condensed Matter Physics; Electronic, Optical and Magnetic Materials; Atomic and Molecular Physics, and Optics; fatigue; thin films; Surfaces, Coatings and Films; multilayers
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Research Areas:
Materials Characterization: 50% Surfaces and Interfaces: 50%
