Grosser, M., Münch, M., Seidel, H., Bienert, C., Roosen, A., & Schmid, U. (2012). The impact of substrate properties and thermal annealing on tantalum nitride thin films. Applied Surface Science, 258(7), 2894–2900. https://doi.org/10.1016/j.apsusc.2011.11.003
Condensed Matter Physics; General Physics and Astronomy; General Chemistry; Surfaces, Coatings and Films; Surfaces and Interfaces
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Abstract:
In this study film properties of sputter-deposited tantalum nitride (TaNx) thin layers are investigated
focusing on the impact of substrate properties, varying nitrogen content for film synthetization as well
as post-deposition annealings in the temperature range up to 500 ◦C. For comparison, these investigations
are done on low temperature co-fired ceramics and on silicon based substrates whereas the latter
approach ensures defined and well-known surface properties. Furthermore, results on the phase evolution
with high temperature annealings are presented showing a transformation of Ta4N to Ta2N in
the temperature range between 350 ◦C and 500 ◦C. With increasing nitrogen content (i.e. nitrogen flow
during film deposition) in the TaNx layers the topography shows first an increase in surface roughness,
next a range where a smoothing of the surface characteristics is observed, and finally buckling and the
existence of grain agglomerates. All these analyses are further evaluated with electrical measurements
on the film resistivity and on the oxidation behaviour to gain deeper insight into material parameters
relevant for micromachined devices which are operated under harsh environmental conditions.
de
In this study film properties of sputter-deposited tantalum nitride (TaNx) thin layers are investigated
focusing on the impact of substrate properties, varying nitrogen content for film synthetization as well
as post-deposition annealings in the temperature range up to 500 ◦C. For comparison, these investigations
are done on low temperature co-fired ceramics and on silicon based substrates whereas the latter
approach ensures defined and well-known surface properties. Furthermore, results on the phase evolution
with high temperature annealings are presented showing a transformation of Ta4N to Ta2N in
the temperature range between 350 ◦C and 500 ◦C. With increasing nitrogen content (i.e. nitrogen flow
during film deposition) in the TaNx layers the topography shows first an increase in surface roughness,
next a range where a smoothing of the surface characteristics is observed, and finally buckling and the
existence of grain agglomerates. All these analyses are further evaluated with electrical measurements
on the film resistivity and on the oxidation behaviour to gain deeper insight into material parameters
relevant for micromachined devices which are operated under harsh environmental conditions.
en
Research Areas:
Sensor Systems: 45% Special and Engineering Materials: 35% Materials Characterization: 20%
