Record link: 
http://hdl.handle.net/20.500.12708/189845
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Title: 
Spectral Shaping In Ultra-Thin Terahertz Quantum Cascade Laser Pairs
en
Citation: 
Ertl, M. C., Jaidl, M., Limbacher, B., Theiner, D., Giparakis, M., Beiser, M., Andrews, A. M., Strasser, G., Darmo, J., & Unterrainer, K. (2023). Spectral Shaping In Ultra-Thin Terahertz Quantum Cascade Laser Pairs. In 2023 48th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz) (pp. 1–2). IEEE. https://doi.org/10.1109/IRMMW-THz57677.2023.10299208
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Publisher DOI: 
10.1109/IRMMW-THz57677.2023.10299208
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Publication Type: 
Inproceedings - Full-Paper Contribution
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Language: 
English
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Authors: 
Ertl, Marie C. 
Jaidl, Michael 
Limbacher, Benedikt 
Theiner, Dominik 
Giparakis, Miriam 
Beiser, Maximilian 
Andrews, Aaron M. 
Strasser, Gottfried 
Darmo, Juraj 
Unterrainer, Karl 
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Organisational Unit: 
E387-01 - Forschungsbereich Photonik 
E362-01 - Forschungsbereich Optoelektronische Materialien 
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Published in: 
2023 48th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz) 
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ISBN: 
979-8-3503-3660-3
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Date (published): 
2023
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Event name: 
48th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz 2023) 
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Event date: 
17-Sep-2023 - 22-Sep-2023
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Event place: 
Montreal, Quebec, Canada
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Number of Pages: 
2
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Publisher: 
IEEE
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Peer reviewed: 
Yes
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Keywords: 
terahertz; quantum cascade laser; flip chip bonding; wire laser; aser array
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Research Areas: 
Materials Characterization: 15%
Telecommunication: 15%
Photonics: 70%
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Science Branch: 
2020 - Elektrotechnik, Elektronik, Informationstechnik: 100%
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Appears in Collections:
Conference Paper

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