Record link: 
http://hdl.handle.net/20.500.12708/211725
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Title: 
Microstructural Features and Crystallographic Texture of Sn3.5Ag Solder Joints Produced with Fe-Nanoparticle Doped Flux*
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Citation: 
Wodak, I., Khodabakhshi, F., Yakymovych, A., & Khatibi Damavandi, G. (2023). Microstructural Features and Crystallographic Texture of Sn3.5Ag Solder Joints Produced with Fe-Nanoparticle Doped Flux*. In Institute of Electrical and Electronics Engineers Inc. (Ed.), 2023 IEEE Nanotechnology Materials and Devices Conference (NMDC) (pp. 711–716). https://doi.org/10.1109/NMDC57951.2023.10343630
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Publisher DOI: 
10.1109/NMDC57951.2023.10343630
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Publication Type: 
Inproceedings - Full-Paper Contribution
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Language: 
English
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Authors: 
Wodak, Irina 
Khodabakhshi, Farzad 
Yakymovych, Andriy 
Khatibi Damavandi, Golta 
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Organisational Unit: 
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit 
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Published in: 
2023 IEEE Nanotechnology Materials and Devices Conference (NMDC) 
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ISBN: 
979-8-3503-3546-0
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Date (published): 
2023
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Event name: 
IEEE Nanotechnology Materials and Devices Conference (NMDC 2023) 
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Event date: 
22-Oct-2023 - 25-Oct-2023
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Event place: 
Italy
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Number of Pages: 
6
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Peer reviewed: 
Yes
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Keywords: 
nanosolders; microstrcuture; texture; intermetallics
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Abstract: 
This study concerns the effect of Fe nanoparticles (NPs) addition on the structure and performance of Sn3.5Ag solder joints. Alternative to the commonly used strategy of mixing nanoparticles with the solder, various amounts (0.0-2wt%) of Fe-NPs were added to the flux. Solder joints were then prepared by placing the NP-doped flux between the Sn-based solder foils and Cu substrates to achieve a proportionally high concentration of the NPs at the interface. The effect of Fe-nanoparticle additions on the formation and growth of interfacial intermetallic compounds (IMCs) and the microstructure of the bulk solder was investigated in as-reflow condition and after thermal aging up to 180°C and 480h. The results showed a reduced growth rate of the interfacial intermetallic phases (IMCs) of the solder joints prepared with NP-doped flux. Detailed structural and chemical analyses revealed the encountered interfacial reactions and dominancy of strong textural components for the Fe-NP-doped Sn-based solder joints.
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Project title: 
Hybrid-Lötstellen - neue vielversprechende Lötstrategie: P 34894-N (FWF - Österr. Wissenschaftsfonds) 
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Research Areas: 
Materials Characterization: 50%
Surfaces and Interfaces: 50%
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Science Branch: 
1040 - Chemie: 80%
2020 - Elektrotechnik, Elektronik, Informationstechnik: 20%
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Appears in Collections:
Conference Paper

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