Record link: 
https://doi.org/10.34726/hss.2025.132496
http://hdl.handle.net/20.500.12708/217705
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Title: 
Solubility limits of Cu, Ag, and Ni in physical vapor deposited TiN thin films
en
Citation: 
Kuttelwascher, P. (2025). Solubility limits of Cu, Ag, and Ni in physical vapor deposited TiN thin films [Diploma Thesis, Technische Universität Wien]. reposiTUm. https://doi.org/10.34726/hss.2025.132496
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reposiTUm DOI: 
10.34726/hss.2025.132496
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CatalogPlus: 
AC17598844
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Publication Type: 
Thesis - Diplomarbeit
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Language: 
English
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Authors: 
Kuttelwascher, Philip 
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Advisor: 
Riedl-Tragenreif, Helmut 
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Organisational Unit: 
E308 - Institut für Werkstoffwissenschaft und Werkstofftechnologie 
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Date (published): 
2025
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Number of Pages: 
66
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Keywords: 
PVD Ti-X-N; Löslichkeitsgrenzen
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PVD Ti-X-N; solubility limits
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License: 
In Copyright
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Appears in Collections:
Thesis

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