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Record link:
https://doi.org/10.34726/hss.2025.132496
http://hdl.handle.net/20.500.12708/217705
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Title:
Solubility limits of Cu, Ag, and Ni in physical vapor deposited TiN thin films
en
Citation:
Kuttelwascher, P. (2025).
Solubility limits of Cu, Ag, and Ni in physical vapor deposited TiN thin films
[Diploma Thesis, Technische Universität Wien]. reposiTUm. https://doi.org/10.34726/hss.2025.132496
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reposiTUm DOI:
10.34726/hss.2025.132496
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CatalogPlus:
AC17598844
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Publication Type:
Thesis - Diplomarbeit
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Language:
English
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Authors:
Kuttelwascher, Philip
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Advisor:
Riedl-Tragenreif, Helmut
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Organisational Unit:
E308 - Institut für Werkstoffwissenschaft und Werkstofftechnologie
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Date (published):
2025
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Number of Pages:
66
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Keywords:
PVD Ti-X-N; Löslichkeitsgrenzen
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PVD Ti-X-N; solubility limits
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License:
In Copyright
de
Appears in Collections:
Thesis
Fulltext (Version of Record (published version))
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Embargo. Accessible from 31.07.2027
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