Over the years, additive manufacturing (also known as 3D printing) has become a well-established processing method for production-quality parts that can compete in several market sectors. [1,2] In particular, single material processes are well understood and controlled. However, to fully exploit the potential of this technique, multi-material printing is the logical next step to be mastered to produce innovative compounds in various fields such as biomedical, aerospace/automotive or electronics. In the field of electronics, multi-material printing can help facilitating the recycling process by enabling the creation of compounds that are designed to be easily dismantled, thereby contributing to a more sustainable economy. The concept of “Design for Disassembly” is at the core of this approach, and multi-material printing in vat photopolymerisation has been employed to create such components using an (methacrylate)-system as material A and an allyl-thiol system as material B.[3] However, when it comes to multi-material printing, the correct adhesion of the two materials at the interface is imperative to the overall properties of the component. In this regard, the chemical nature of the functional groups of the employed materials determines whether the bonding conditions at the interface are covalent or in an interpenetrating polymer network (IPN) like manner. The present study introduces a third material (Material C), which consists of an acrylate-thiol-system, with the aim of investigating the comparing (thermo)mechanical properties of 3D multi-material printed parts. This investigation will observe the importance of proper layer adhesion at the interface. To this end, we have also investigated commercially available photoinitiators and heteroatoms regarding their capacity to track the intermingling of the two materials at the interface and the creation of the diffusion zone via SEM (scanning electron microscope) imaging and EDX measurements.