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Record link: 
http://hdl.handle.net/20.500.12708/73167
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Title: 
Thermomechanical Consideration of Stress and Strain of a Thick-Wire Bond During Short-Circuit Load
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Citation: 
Nagl, B., Nicolics, J., Suhir, E., & Gschohsmann, W. (2012). Thermomechanical Consideration of Stress and Strain of a Thick-Wire Bond During Short-Circuit Load. In Book of Abstracts (pp. 116–117). http://hdl.handle.net/20.500.12708/73167
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Publication Type: 
Inproceedings - Full-Paper Contribution
en
Authors: 
Nagl, Bernhard 
Nicolics, Johann 
Suhir, Ephraim 
Gschohsmann, Walter 
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Organisational Unit: 
E366-02 - Forschungsbereich Mikrosystemtechnik 
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Published in: 
Book of Abstracts 
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Date (published): 
2012
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Event name: 
35th International Spring Seminar on Electronics Technology (ISSE 2012) 
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Event date: 
9-May-2012 - 13-May-2012
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Event place: 
Bad Aussee, Austria
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Number of Pages: 
2
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Peer reviewed: 
Yes
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Research Areas: 
Sensor Systems: 25%
Special and Engineering Materials: 40%
Materials Characterization: 35%
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Science Branch: 
Elektrotechnik, Elektronik
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Appears in Collections:
Conference Paper

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