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Record link: 
http://hdl.handle.net/20.500.12708/73168
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Title: 
Transient Thermomechanical Study of a Thick-Wire Bond With Particular Attention to the Interfacial Shearing Stress
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Citation: 
Nagl, B., Suhir, E., Gschohsmann, W., & Nicolics, J. (2012). Transient Thermomechanical Study of a Thick-Wire Bond With Particular Attention to the Interfacial Shearing Stress. In Conference Proceedings of the 2012 35th International Spring Seminar on Electronics Technology (pp. 339–344). IEEE Xplore. http://hdl.handle.net/20.500.12708/73168
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Publication Type: 
Inproceedings - Full-Paper Contribution
en
Authors: 
Nagl, Bernhard 
Suhir, Ephraim 
Gschohsmann, Walter 
Nicolics, Johann 
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Organisational Unit: 
E366-02 - Forschungsbereich Mikrosystemtechnik 
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Published in: 
Conference Proceedings of the 2012 35th International Spring Seminar on Electronics Technology 
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Date (published): 
2012
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Number of Pages: 
6
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Publisher: 
IEEE Xplore
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Peer reviewed: 
No
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Science Branch: 
Elektrotechnik, Elektronik
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Appears in Collections:
Conference Paper

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