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Record link: 
http://hdl.handle.net/20.500.12708/76561
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Title: 
Investigation on the Lifetime of Copper Wire Bonds in Electronic Packages under Thermal and Mechanical Cyclic Loading
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Citation: 
Mazloum-Nejadari, A., Lederer, M., Khatibi, G., Czerny, B., Weiss, L., & Nicolics, J. (2018). Investigation on the Lifetime of Copper Wire Bonds in Electronic Packages under Thermal and Mechanical Cyclic Loading. In Proceedings ESTC 2018 (p. 7). http://hdl.handle.net/20.500.12708/76561
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Publication Type: 
Inproceedings - Full-Paper Contribution
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Authors: 
Mazloum-Nejadari, A. 
Lederer, Martin 
Khatibi, Golta 
Czerny, Bernhard 
Weiss, L. 
Nicolics, Johann 
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Organisational Unit: 
E366-02 - Forschungsbereich Mikrosystemtechnik 
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit 
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Published in: 
Proceedings ESTC 2018 
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Date (published): 
2018
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Event name: 
7th Electronic System-Integration Technology Conference (ESTC) 
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Event date: 
18-Sep-2018 - 21-Sep-2018
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Event place: 
Dresden, Germany
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Number of Pages: 
7
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Science Branch: 
Elektrotechnik, Elektronik, Informationstechnik
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Appears in Collections:
Conference Paper

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