Record link: 
http://hdl.handle.net/20.500.12708/77164
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Title: 
Electromigration Model for Platinum Hotplates
en
Citation: 
Filipovic, L. (2020). Electromigration Model for Platinum Hotplates. In 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Tokyo, Japan. IEEE. https://doi.org/10.23919/sispad49475.2020.9241645
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Publisher DOI: 
10.23919/sispad49475.2020.9241645
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Publication Type: 
Inproceedings - Full-Paper Contribution
en
Language: 
English
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Authors: 
Filipovic, Lado 
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Organisational Unit: 
E360 - Institut für Mikroelektronik 
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Published in: 
2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 
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ISBN: 
978-4-86348-763-5
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DOI of the book: 
10.23919/SISPAD49475.2020.9241672
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Date (published): 
2020
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Event name: 
2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 
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Event date: 
23-Sep-2020 - 6-Oct-2020
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Event place: 
Tokyo, Japan
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Number of Pages: 
4
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Publisher: 
IEEE
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Science Branch: 
Elektrotechnik, Elektronik, Informationstechnik
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Appears in Collections:
Conference Paper

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