Record link: 
http://hdl.handle.net/20.500.12708/223585
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Title: 
Thermally-Induced Morphology Changes in Subtractive Ru Lines and Their Mitigation
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Citation: 
Zahedmanesh, H., Delie, G., Asif A. Shah, Ceric, H., Shrivastava, M., Park, S., & Tokei, Z. (2025). Thermally-Induced Morphology Changes in Subtractive Ru Lines and Their Mitigation. In 2025 IEEE International Interconnect Technology Conference (IITC). 2025 IEEE International Interconnect Technology Conference (IITC), Busan, Korea (the Republic of). IEEE. https://doi.org/10.1109/IITC66087.2025.11075477
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Publisher DOI: 
10.1109/IITC66087.2025.11075477
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Publication Type: 
Inproceedings - Full-Paper Contribution
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Language: 
English
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Authors: 
Zahedmanesh, Houman 
Delie, Gilles 
Asif A. Shah 
Ceric, Hajdin 
Shrivastava, Mayank 
Park, Seongho 
Tokei, Zsolt 
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Organisational Unit: 
E360-01 - Forschungsbereich Mikroelektronik 
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Published in: 
2025 IEEE International Interconnect Technology Conference (IITC) 
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ISBN: 
979-8-3315-3782-1
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DOI of the book: 
10.1109/IITC66087.2025
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Date (published): 
16-Jul-2025
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Event name: 
2025 IEEE International Interconnect Technology Conference (IITC) 
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Event date: 
2-Jun-2025 - 5-Jun-2025
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Event place: 
Busan, Korea (the Republic of)
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Number of Pages: 
3
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Publisher: 
IEEE
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Peer reviewed: 
Yes
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Keywords: 
cylinderization; grain-boundary grooving; morphology change; Subtractive Ru nano-interconnects
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Abstract: 
Etched Ru lines with 10 nm nominal linewidth and open interline space were annealed at 325 °C, 420 °C and 650 °C for up to 5 hours to explore thermal stability of their grain structure and morphology. The etched Ru lines showed drastic cylinderization of grains in cross-sectional and planar TEMs, which increased with anneal temperature. Atomistic and physics-based simulations showed surface diffusion to control the dynamics. In extreme cases, the morphology changes resulted in shorts between lines and a significant number of line breaks. Geometrical parameters such as line and grain aspect ratios, surface, interface and grain boundary energies and crystal orientation were found to be implicated. It is shown that suppressing surface diffusion of Ru will mitigate the instabilities.
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Research Areas: 
Modeling and Simulation: 30%
Computational Materials Science: 70%
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Science Branch: 
2020 - Elektrotechnik, Elektronik, Informationstechnik: 100%
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Appears in Collections:
Conference Paper

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