|
| | Preview | Author(s) | Title | Type | Issue Date |
| 41 | | Walter, Thomas ; Zareghomsheh, Mohammad ; Khatibi, Golta ; Danninger, Herbert | Adhesion properties of thin film multilayers: Comparison of nanoindentation and four-point-bending techniques | Artikel Article  | 2021 |
| 42 | | Goekdeniz, Zeynep ; Lederer, Martin ; Khatibi, Golta ; Nicolics, Johann | Temperature Dependent Relaxation Behavior of Ag-Sintered Copper Joints | Konferenzbeitrag Inproceedings | 2021 |
| 43 | | Khatibi, Golta | Reliability and lifetime assessment in power electronics | Präsentation Presentation | 2021 |
| 44 | | Castillo, Enrique ; Fernández-Canteli, Alfonso ; Blasón, Sergio ; Khatibi, Golta ; Czerny, Bernhard ; Zareghomsheh, Mohammad | Step-by-Step Building of a Four Dimensional Fatigue Compatible Regression Model including Frequencies | Artikel Article | 2021 |
| 45 | | Aspalter, Anna ; Cerny, Angelika ; Goeschl, Michael ; Podsednik, Maximilian ; Khatibi, Golta ; Yakymovych, Andriy ; Plevachuk, Yuri | Hybrid solder joints: morphology and shear strength of Sn–3.0Ag–0.5Cu solder joints by adding ceramic nanoparticles through flux doping | Artikel Article | 23-Apr-2020 |
| 46 | | Gökdeniz, Z.G. ; Khatibi, Golta ; Gierl-Mayer, Christian ; Steiger-Thirsfeld, Andreas ; Mündlein, Martin | Temperature Dependent Physical Properties of Sintered Silver Layers for Power Electronics | Konferenzbeitrag Inproceedings | 2020 |
| 47 | | Lederer, Martin ; Kotas, Agnieszka Betwar ; Khatibi, Golta ; Danninger, Herbert | On crack propagation in homogeneous and composite materials under mixed mode loading conditions | Konferenzbeitrag Inproceedings | 2020 |
| 48 | | Khatibi, Golta ; Kirchgaßner, Martin | A method for evaluation of weld overlays exposed to combined wear and very high cycle fatigue conditions | Konferenzbeitrag Inproceedings | 2020 |
| 49 | | Zareghomsheh, Mohammad ; Khatibi, Golta ; Weiss, Brigitte ; Lederer, Martin ; Schwarz, Sabine ; Steiger-Thirsfeld, Andreas ; Tikhonovsky, M. ; Tabachnikova, E.D. ; Schafler, Erhard | High cycle fatigue deformation mechanisms of a single phase CrMnFeCoNi high entropy alloy | Artikel Article | 2020 |
| 50 | | Khodabakhshi, Farzad ; Zareghomsheh, Mohammad ; Khatibi, Golta | Nanoindentation creep behavior of SAC-based lead-free nanocomposite solders reinforced by Ni-coated MW-CNTs | Artikel Article | 2020 |
| 51 | | Haddadi, Bahram ; Jordan, Christian ; Wedl, Günter ; Harasek, Michael ; Gasser, Christoph ; Lendl, Bernhard | Endbericht Projekt "LaserEye" | Bericht Report | 2020 |
| 52 | | Sayyadi, R. ; Khodabakhshi, F. ; Javid, N. Shahamat ; Khatibi, G. | Influence of graphene content and nickel decoration on the microstructural and mechanical characteristics of the Cu/Sn-Ag-Cu/Cu soldered joint | Artikel Article | 2020 |
| 53 | | Lederer, M. ; Kotas, A. Betzwar ; Khatibi, G. | A lifetime assessment and prediction method for large area solder joints | Artikel Article | 2020 |
| 54 | | Czerny, B. ; Khatibi, G. | Interface characterization of Cu-Cu ball bonds by a fast shear fatigue method | Artikel Article | 2020 |
| 55 | | Gökdeniz, Z.G. ; Mündlein, Martin ; Khatibi, Golta ; Steiger-Thirsfeld, Andreas ; Nicolics, Johann | Ermüdungsverhalten hoch-belasteter Ag-Sinterverbindungen | Konferenzbeitrag Inproceedings | 2020 |
| 56 | | Lederer, Martin | Material Frame Indifferent Strain Gradient Elasticity: Theoretical formulation and mixed type Finite Element implementation | Konferenzbeitrag Inproceedings | 2020 |
| 57 | | Czerny, Bernhard ; Khatibi, Golta ; Geißler, Ute | Loop formation effects on the lifetime of wire bonds for power electronics | Konferenzbeitrag Inproceedings | 2020 |
| 58 | | Czerny, Bernhard | Wire bond reliability and accelerated mechanical testing | Präsentation Presentation | 2019 |
| 59 | | Khatibi, Golta | Alternative accelerated qualification methods for electronic components | Präsentation Presentation | 2019 |
| 60 | | Walter, Thomas | Methods for evaluation of thin film adhesion in power electronics | Präsentation Presentation | 2019 |
