Czerny, B., Mazloum-Nejadari, A., Khatibi, G., Weiss, L., & Zehetbauer, M. J. (2016). Fatigue testing method for fine bond wires in an LQFP package. Microelectronics Reliability, 64, 270–275. https://doi.org/10.1016/j.microrel.2016.07.068
E366 - Institut für Sensor- und Aktuatorsysteme E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit E164 - Institut für Chemische Technologien und Analytik
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Journal:
Microelectronics Reliability
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ISSN:
0026-2714
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Date (published):
Sep-2016
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Number of Pages:
6
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Publisher:
PERGAMON-ELSEVIER SCIENCE LTD
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Peer reviewed:
Yes
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Keywords:
Electrical and Electronic Engineering; Condensed Matter Physics; Electronic, Optical and Magnetic Materials; Atomic and Molecular Physics, and Optics; Safety, Risk, Reliability and Quality; Surfaces, Coatings and Films
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Research Areas:
Modelling and Simulation: 30% Materials Characterization: 30% Structure-Property Relationship: 40%
