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| | Preview | Author(s) | Title | Type | Issue Date |
| 21 | | Khatibi Damavandi, Golta ; Czerny, Bernhard ; Walter, Thomas ; Lederer, Martin ; Betzwar Kotas, Agnieszka Monika ; Zareghomsheh, Mohammad | PoF Based Accelerated Testing | Presentation Vortrag | Jun-2022 |
| 22 | | Lederer, Martin ; Gökdeniz, Zeynep Gökce ; Khatibi Damavandi, Golta ; Nicolics, Johann | Temperaturabhängigkeit mechanischer Eigenschaften von Niedertemperatur-Silber-Sinterschichten und deren Modellierung für die Nutzung in FiniteElemente-Simulationen | Inproceedings Konferenzbeitrag | Jun-2022 |
| 23 | | Khatibi Damavandi, Golta | Reliability Assessment of Thin Films and Multilayers in Electronic Packages | Presentation Vortrag | 26-May-2022 |
| 24 | | Wodak, Irina ; Yakymovych, Andriy ; Strutz P. ; Wimmer C. ; Yerbol S. ; Khatibi Damavandi, Golta | Hybrid solder joints: the effect of nano-sized Ni and ceramic admixtures on morphology and shear strength of Sn-5.0Ag solder joints | Presentation Vortrag | 4-May-2022 |
| 25 | | Wodak, Irina ; Yakymovych, Andriy ; Khatibi Damavandi, Golta | Insights into synthesis of nanosized Ni and Fe particles by chemical reduction method | Presentation Vortrag | 4-May-2022 |
| 26 | | Yakymovych, Andriy ; Plevachuk, Yuriy ; Svec, P. ; Svec Sr. P. ; Sklyarchuk V. | Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites | Presentation Vortrag | 4-May-2022 |
| 27 | | Rafiee, Peyman ; Khatibi, Golta ; Solazzi, Francesco | Optically-detected nonlinear oscillations of single crystal silicon MEMS accelerometers | Article Artikel  | 2022 |
| 28 | | Lederer, Martin ; Betzwar Kotas, Agnieszka Monika ; Khatibi Damavandi, Golta | Accelerated Fatigue Testing and Lifetime Modelling of Solder Interconnects in Power Electronics | Presentation Vortrag | 2022 |
| 29 | | Khatibi Damavandi, Golta ; Czerny, Bernhard | Mechanical lifetime testing of wire bonds vs power cycling | Presentation Vortrag | 2022 |
| 30 | | Betzwar Kotas, Agnieszka Monika ; Lederer, Martin ; Khatibi Damavandi, Golta ; Boczkal, Grzegorz ; Perek-Nowak M. | Mechanical Reliability of Lead-Free Solder Joints: Comparative Study of Sn3.5Ag versus SnSbAg Solder Alloy | Presentation Vortrag | 2022 |
| 31 | | Wodak, Irina ; Yakymovych, Andriy ; Khatibi Damavandi, Golta | Insight into synthesis of nanosized Ni and Fe particles by chemical reduction method | Inproceedings Konferenzbeitrag | 2022 |
| 32 | | Czerny, Bernhard ; Khatibi Damavandi, Golta | Highly accelerated lifetime testing in power electronics | Inproceedings Konferenzbeitrag | 2022 |
| 33 | | Czerny, Bernhard ; Khatibi Damavandi, Golta | Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics | Article Artikel | 2022 |
| 34 | | Fernández-Canteli, Alfonso ; Castillo, Enrique ; Blasón, Sergio ; Khatibi Damavandi, Golta ; Czerny, Bernhard ; Zareghomsheh, Mohammad | Un modelo integral para describir la influencia de la frecuencia de ensayo sobre los resultados de fatiga | Article Artikel | 2022 |
| 35 | | Betzwar Kotas, Agnieszka Monika ; Khatibi, Golta ; Khodabakhshi, Farzad ; Steiger-Thirsfeld, Andreas | High Cycle Fatigue Behaviour of Cu/Sn Intermetallic Compounds Prepared by Transient Liquid Phase Bonding Process | Artikel Article | Jan-2021 |
| 36 | | Lederer, Martin ; Walter, Thomas ; Khatibi, Golta | Modelling of Cyclic Delamination Behavior of Thin Multilayered Structures Using Gradient Elasticity and Damage Accumulation | Artikel Article | Jan-2021 |
| 37 | | Walter, Thomas ; Zareghomsheh, Mohammad ; Khatibi, Golta ; Popok, Vladimir ; Kristensen, Peter ; Schwarz, Sabine | Interfacial adhesion strength of III-N heterostructures | Präsentation Presentation | 2021 |
| 38 | | Goekdeniz, Zeynep ; Lederer, Martin ; Khatibi, Golta ; Nicolics, Johann | Temperature Dependent Relaxation Behavior of Pressureless and Pressure Assisted Sintered Silver | Konferenzbeitrag Inproceedings | 2021 |
| 39 | | Lederer, M. ; Gökdeniz, Z. ; Khatibi, G. ; Nicolics, J. | Constitutive equations for strain rate and temperature dependent mechanical behaviour of porous Ag-sintered joints in electronic packages | Artikel Article | 2021 |
| 40 | | Lederer, M ; Walter, T ; Zareghomsheh, M ; Khatibi, G | Delamination Criteria for SiN/TiW Interfaces Tested by Cross-Sectional Nanoidentation and by Four Point Bending | Konferenzbeitrag Inproceedings | 2021 |
