Institut für Mikroelektronik

Organization Name (de) Name der Organisation (de)
E360 - Institut für Mikroelektronik
 
Code Kennzahl
E360
 
Type of Organization Organisationstyp
Institute
Parent OrgUnit Übergeordnete Organisation
 
Active Aktiv
 

SubOrgUnits

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PreviewAuthor(s)TitleTypeIssue Date
21Zarate-Galvez-2023-ECS Journal of Solid State Science and Technology-vor.PDF.jpgZarate-Galvez, Sarai ; Garcia-Barrientos, Abel ; Lastras-Martinez, Luis Felipe ; Cardenas-Juarez, Marco ; Macias-Velasquez, Sharon ; Filipovic, Lado ; Arce-Casas, Armando Optimization of Doping Concentration to Obtain High Internal Quantum Efficiency and Wavelength Stability in An InGaN/GaN Blue Light-Emitting DiodeArticle Artikel Jul-2023
22Medina-Bailon-2023-Nano Express-vor.pdf.jpgMedina-Bailon, Cristina ; Nedialkov, Mihail Hristov ; Georgiev, Vihar ; Selberherr, Siegfried ; Asenov, Asen Comprehensive mobility study of silicon nanowire transistors using multi-subband modelsArticle Artikel Jun-2023
23Knobloch, Theresia ; Selberherr, Siegfried ; Grasser, Tibor High-Performance Field-Effect Transistors Based on Two-Dimensional Materials for VLSI CircuitsArticle Artikel 19-May-2023
24HosseinpourRokni, Mohsen ; Naderi, Reza ; Soleimani, Maryam ; Kowsari, Elaheh ; Pourfath, Mahdi Indirect interactions between the ionic liquid and Cu surface in 0.5 M HCl: a novel mechanism explaining cathodic corrosion inhibitionArticle Artikel 15-May-2023
25Leroch, S. ; Eder, Stefan ; Varga, M. ; Rodríguez Ripoll, M. Material point simulations as a basis for determining Johnson–Cook hardening parameters via instrumented scratch testsArticle Artikel 1-Apr-2023
26Bobinac, Josip ; Reiter, Tobias ; Piso, Julius ; Klemenschits, Xaver ; Baumgartner, Oskar ; Stanojevic, Zlatan ; Strof, Georg ; Karner, Markus ; Filipovic, Lado Effect of Mask Geometry Variation on Plasma Etching ProfilesArticle Artikel 16-Mar-2023
27Bobinac-2023-Micromachines-vor.pdf.jpgBobinac, Josip ; Reiter, Tobias ; Piso, Julius ; Klemenschits, Xaver ; Baumgartner, Oskar ; Stanojevic, Zlatan ; Strof, Georg ; Karner, Markus ; Filipovic, Lado Effect of Mask Geometry Variation on Plasma Etching ProfilesArticle Artikel 16-Mar-2023
28Ceric, Hajdin ; Zahedmanesh, Houman ; Croes, Kristof ; Lacerda de Orio, Roberto ; Selberherr, Siegfried Electromigration-Induced Void Evolution and Failure of Cu/SiCN Hybrid BondsArticle Artikel 14-Mar-2023
29Soleimani, Maryam ; Pourfath, Mahdi A comprehensive investigation of the plasmonic-photocatalytic properties of gold nanoparticles for CO₂ conversion to chemicalsArticle Artikel 2-Mar-2023
30Bendra-2023-Solid-State Electronics-vor.pdf.jpgBendra, Mario ; Fiorentini, Simone ; Goes, Wolfgang ; Selberherr, Siegfried ; Sverdlov, Viktor The Influence of Interface Effects on the Switching Behavior in Ultra-Scaled MRAM CellsArticle Artikel Mar-2023
31Aguinsky-2023-Solid-State Electronics-vor.pdf.jpgAguinsky, Luiz Felipe ; Souza Berti Rodrigues, Francio ; Reiter, Tobias ; Klemenschits, Xaver ; Filipovic, Lado ; Hössinger, Andreas ; Weinbub, Josef Modeling Incomplete Conformality During Atomic Layer Deposition in High Aspect Ratio StructuresArticle Artikel Mar-2023
32Lenz-2023-Journal of Scientific Computing-vor.pdf.jpgLenz, Christoph ; Aguinsky, Luiz Felipe ; Hössinger, Andreas ; Weinbub, Josef A Complementary Topographic Feature Detection Algorithm Based on Surface Curvature for Three-Dimensional Level-Set FunctionsArticle Artikel Mar-2023
33Lenz, Christoph ; Aguinsky, Luiz Felipe ; Hössinger, Andreas ; Weinbub, Josef A Complementary Topographic Feature Detection Algorithm Based on Surface Curvature for Three-Dimensional Level-Set FunctionsArticle Artikel 8-Feb-2023
34Dehdast, Mahyar ; Neek-Amal, Mehdi ; Stampfl, Catherine ; Pourfath, Mahdi Strain engineering of hyperbolic plasmons in monolayer carbon phosphide: a first-principles studyArticle Artikel 7-Feb-2023
35Leroch-2023-Frontiers in Manufacturing Technology-vor.pdf.jpgLeroch, S. ; Grützmacher, Philipp ; Heckes, H. ; Eder, Stefan Towards a multi-abrasive grinding model for the material point methodArticle Artikel 3-Feb-2023
36Ceric, Hajdin ; Lacerda de Orio, Roberto ; Selberherr, Siegfried Microstructural impact on electromigration reliability of gold interconnectsArticle Artikel Feb-2023
37Lenz-2023-Solid-State Electronics-vor.pdf.jpgLenz, Christoph ; Manstetten, Paul ; Aguinsky, Luiz Felipe ; Rodrigues, Francio ; Hössinger, Andreas ; Weinbub, Josef Automatic Grid Refinement for Thin Material Layer Etching in Process TCAD SimulationsArtikel Article Feb-2023
38Hadamek-2023-Solid-State Electronics-vor.pdf.jpgHadamek, Tomas ; Selberherr, Siegfried ; Wolfgang Goes ; Sverdlov, Viktor Modeling Thermal Effects in STT-MRAMArticle Artikel Feb-2023
39Filipovic, Lado ; Baumgartner, Oskar ; Klemenschits, Xaver ; Piso, Julius ; Bobinac, Josip ; Reiter, Tobias ; Strof, Georg ; Rzepa, Gerhard ; Stanojevic, Zlatan ; Karner, Markus DTCO flow for air spacer generation and its impact on power and performance at N7Article Artikel Jan-2023
40Fiorentini, Simone ; Ender, Johannes ; Selberherr, Siegfried ; Lacerda de Orio, Roberto ; Goes, Wolfgang ; Sverdlov, Viktor Comprehensive evaluation of torques in ultra-scaled MRAM devicesArticle Artikel Jan-2023