Microelectronics Reliability

Title Titel
Microelectronics Reliability
 
e-ISSN
1872-941X
 
ISSN
0026-2714
 
Publisher Herausgeber
PERGAMON-ELSEVIER SCIENCE LTD
 
Listed in SCI Aufgelistet im SCI
 
Peer reviewed Begutachtet
 
 
 

Publications Publikationen

Results 41-60 of 108 (Search time: 0.004 seconds).

PreviewAuthor(s)TitleTypeIssue Date
41Notermans, Guido ; Bychikhin, Sergey ; Pogany, Dionyz ; Johnsson, David ; Maksimovic, Dejan HMM-TLP correlation for system-efficient ESD designArtikel Article2012
42Heer, M. ; Grombach, P. ; Heid, A. ; Pogany, D. Hot spot analysis during thermal shutdown of SOI BCDMOS half bridge driver for automotive applicationsArtikel Article2008
43Goes, W. ; Wimmer, Y. ; El-Sayed, A.-M. ; Rzepa, G. ; Jech, M. ; Shluger, A.L. ; Grasser, T. Identification of Oxide Defects in Semiconductor Devices: A Systematic Approach Linking DFT to Rate Equations and Experimental EvidenceArtikel Article 2018
44Abermann, Stephan ; Efavi, J ; Sjöblom, G ; Lemme, M ; Olsson, Jörgen ; Bertagnolli, Emmerich Impact of Al-, Ni-, TiN-, and Mo-mental gates on MOCVD-grown HfO₂ and ZrO₂high-κ dielectricsArtikel Article2007
45Pobegen, Gregor ; Aichinger, Thomas ; Grasser, Tibor ; Nelhiebel, Michael Impact of Gate Poly Doping and Oxide Thickness on the N- and PBTI in MOSFETsArtikel Article2011
46Tyaginov, Stanislav ; Sverdlov, Viktor ; Starkov, Ivan ; Gös, Wolfgang ; Grasser, Tibor Impact of O-Si-O Bond Angle Fluctuations on the Si-O Bond-Breakage RateArtikel Article2009
47Waltl, Michael ; Waldhoer, Dominic ; Tselios, Konstantinos ; Stampfer, Bernhard ; Schleich, Christian ; Rzepa, Gerhard ; Enichlmair, Hubert ; Ioannidis, Eleftherios G. ; Minixhofer, Rainer ; Grasser, Tibor Impact of Single-Defects on the Variability of CMOS Inverter CircuitsArtikel Article 2021
48Waltl-2021-Microelectronics Reliability-vor.pdf.jpgWaltl, Michael ; Waldhör, Dominic ; Tselios, Konstantinos ; Stampfer, Bernhard ; Schleich, Christian ; Rzepa, Gerhard ; Enichlmair, Hubert ; Ioannidis, Eleftherios G. ; Minixhofer, Rainer ; Grasser, Tibor Impact of single-defects on the variability of CMOS inverter circuitsArticle Artikel Nov-2021
49Köck, Helmut ; Djelassi, Christian ; Filippis, Stefano de ; Illing, Robert ; Nelhiebel, Michael ; Ladurner, Markus ; Glavanovics, Michael ; Pogany, Dionyz Improved thermal management of low voltage power devices with optimized bond wire positionsArtikel Article2011
50Ender-2021-Microelectronics Reliability-vor.pdf.jpgEnder, Johannes ; Lacerda de Orio, Roberto ; Fiorentini, Simone ; Selberherr, Siegfried ; Goes, W. ; Sverdlov, Viktor Improving failure rates in pulsed SOT-MRAM switching by reinforcement learningArticle Artikel Nov-2021
51Smetana, Walter ; Reicher, Roland ; Homolka, Heinz Improving reliability of thick film initiators for automotive applications based on FE-analysesArtikel Article2005
52Schramböck, Matthias ; Andrews, Aaron Maxwell ; Roch, Tomas ; Schrenk, Werner ; Strasser, Gottfried In-based quantum dots on AlᵪGa₁₋ᵪAs surfacesArtikel Article2007
53Walter-2023-Microelectronics Reliability-vor.pdf.jpgWalter, Thomas ; Khatibi, G. ; Betzwar Kotas, A. ; Kretschy, Nicole In-situ delamination detection in multi-layered semiconductor packagesArticle Artikel Nov-2023
54Weilguni, Michael ; Smetana, Walter ; Nicolics, Johann ; Kausel, Wilfried ; Goebl, Werner Influence of lamination parameters on mechanical properties of low temperature co-fired ceramic tapesArtikel Article 2011
55Ceric, Hajdin ; de Orio, Roberto Lacerda ; Selberherr, Siegfried Interconnect Reliability Dependence on Fast Diffusivity PathsArtikel Article2012
56Czerny, Bernhard ; Khatibi Damavandi, Golta Interface characterization of Cu Cu ball bonds by a fast shear fatigue methodArticle Artikel Nov-2020
57Czerny, B. ; Khatibi, G. Interface characterization of Cu-Cu ball bonds by a fast shear fatigue methodArtikel Article 2020
58Czerny, B. ; Khatibi, G. Interface reliability and lifetime prediction of heavy aluminum wire bondsArtikel Article 2016
59Tyaginov, S. E. ; Starkov, Ivan ; Triebl, Oliver ; Cervenka, Johann ; Jungemann, C. ; Carniello, Sara ; Park, J.M. ; Enichlmair, H. ; Karner, Markus ; Kernstock, Christian ; Seebacher, E. ; Minixhofer, R. ; Ceric, Hajdin ; Grasser, Tibor Interface Traps Density-of-States as a Vital Component for Hot-Carrier Degradation ModelingArtikel Article2010
60Filipovic, Lado ; Singulani, Anderson Pires ; Roger, Frederic ; Carniello, Sara ; Selberherr, Siegfried Intrinsic Stress Analysis of Tungsten-Lined Open TSVsArtikel Article 2015